Establishing design principles for achieving ultralow thermal conductivity via controlled chemical disorder
A major challenge in thermal-management and thermal-insulation technologies, across multiple industries, is the lack of materials that simultaneously offer low thermal conductivity, mechanical robustness, and scalable fabrication routes.
Image: Phys.org
A major challenge in thermal-management and thermal-insulation technologies, across multiple industries, is the lack of materials that simultaneously offer low thermal conductivity, mechanical robustness, and scalable fabrication routes.
Originally published at Phys.org
